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Falchenko, and V. F. Maznko, Autom. , 27: 15–18, 1974. I. GUTIE´RREZ B. LO´PEZ B. ALEMA´N CEIT and University of Navarra BINARY COUNTERS. See COUNTING CIRCUITS. BINARY PHASE SHIFT KEYING. See PHASE SHIFT KEYING. htm }{{}} ● HOME ● ABOUT US ● CONTACT US ● HELP Home / Engineering / Electrical and Electronics Engineering Wiley Encyclopedia of Electrical and Electronics Engineering Conducting Materials Standard Article Lutz Brandt1, Goran Matijasevic1, Catherine Shearer1, Pradeep Gandhi1 1Ormet Corporation, Carlsbad, CA Copyright © 1999 by John Wiley & Sons, Inc.

The interface formed on the Inconel-Ti6242 couple, analyzed in the previous paragraph, has been described in the same way, using the Ni–Ti–Cr diagram in this case (43). The Use of Interlayers. Depending on their thickness (58), intermetallics at the diffusion couple interface, produce brittle debonding when tensile stress is applied (71). The assembly fails in tension without any plastic deformation at the interface and at a stress level corresponding to the yield stress of the softer material.

Mech. , 38: 157, 1996. 29. M. M. Schwartz, Metals Joining Manual, New York: McGrawHill, 1979. 30. W. F. Gale and E. R. Wallach, Metall. Trans. A, 22A: 2451– 2457, 1991. 31. J. M. , J. de Physique, 5: 373–378, 1995. 32. A. A. Shirzadi and E. R. Wallach, Science Technol. Welding and Joining, 2: 89–94, 1997. 33. B. Lo´pez, I. Gutierrez, and J. J. Urcola, Mater. Sci. , 12: 45–55, 1996. 34. N. F. Kazakov, Diffusion Bonding of Materials, Moscow: Pergamon, 1985, p. 172. 35. D. A. Porter and K. E. Easterling, Diffusion, Phase Transformations in Metals and Alloys, London: Chapman & Hall, 1992, pp.

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